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1. general description the 74axp1g125 is a single buff er/line driver with 3-state output. schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. this device ensures very low static and dynamic power consumption across the entire v cc range from 0.7 v to 2.75 v. it is fully sp ecified for partial powe r down applications using i off . the i off circuitry disables the output, preventing the potentially damaging backflow current through the de vice when it is powered down. 2. features and benefits ? wide supply voltage range from 0.7 v to 2.75 v ? low input capacitance; c i = 0.5 pf (typical) ? low output capacitance; c o = 1.0 pf (typical) ? low dynamic power consumption; c pd = 2.5 pf at v cc = 1.2 v (typical) ? low static power consumption; i cc = 0.6 ? a (85 ? c maximum) ? high noise immunity ? complies with jedec standard: ? jesd8-12a.01 (1.1 v to 1.3 v) ? jesd8-11a.01 (1.4 v to 1.6 v) ? jesd8-7a (1.65 v to 1.95 v) ? jesd8-5a.01 (2.3 v to 2.7 v) ? esd protection: ? hbm ansi/esda/jedec js-001 class 2 exceeds 2 kv ? cdm jesd22-c101e exceeds 1000 v ? latch-up performance exceeds 100 ma per jesd 78 class ii ? inputs accept voltages up to 2.75 v ? low noise overshoot and undershoot < 10 % of v cc ? i off circuitry provides partial power-down mode operation ? multiple package options ? specified from ? 40 ? cto+85 ? c 74axp1g125 low-power buffer/line driver; 3-state rev. 1 ? 16 january 2014 product data sheet
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 2 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74AXP1G125GM ? 40 ? c to +85 ? c xson6 plastic extremely thin sm all outline package; no leads; 6 terminals; body 1 ? 1.45 ? 0.5 mm sot886 74axp1g125gn ? 40 ? c to +85 ? c xson6 extremely thin small outline package; no leads; 6 terminals; body 0.9 ? 1.0 ? 0.35 mm sot1115 74axp1g125gs ? 40 ? c to +85 ? c xson6 extremely thin small outline package; no leads; 6 terminals; body 1.0 ? 1.0 ? 0.35 mm sot1202 74axp1g125gx ? 40 ? c to +85 ? c x2son5 x2son5: plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals; body 0.8 ? 0.8 ? 0.35 mm sot1226 table 2. marking type number marking code [1] 74AXP1G125GM rm 74axp1g125gn rm 74axp1g125gs rm 74axp1g125gx rm fig 1. logic symbol fig 2. iec logic symbol fig 3. logic diagram mna118 ay 2 1 4 oe mna119 1 4 2 en 001aad068 a oe y
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 3 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 6. pinning information 6.1 pinning 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; z = high-impedance off-state. fig 4. pin configuration sot886, sot1115 and sot1202 (xson6) fig 5. pin configuration sot1226 (x2son5) ddd $;3* 7udqvsduhqwwrsylhz 2 (9 && $ qf *1' < 2( 9 && *1' $ < ddd 7udqvsduhqwwrsylhz $;3* table 3. pin description symbol pin description x2son5 xson6 oe 1 1 output enable input a 2 2 data input gnd 3 3 ground (0 v) y 4 4 data output n.c. - 5 not connected v cc 5 6 supply voltage table 4. function table [1] input output oe a y lll lhh hxz
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 4 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 8. limiting values [1] the minimum input and output voltage ratings may be exceed ed if the input and output current ratings are observed. 9. recommended operating conditions table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +3.3 v i ik input clamping current v i <0v ? 50 - ma v i input voltage [1] ? 0.5 +3.3 v i ok output clamping current v o <0v ? 50 - ma v o output voltage [1] ? 0.5 +3.3 v i o output current v o =0 vtov cc - ? 20 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? c to +85 ? c-2 5 0m w table 6. recommended operating conditions voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage 0.7 2.75 v v i input voltage 0 2.75 v v o output voltage active mode 0 v cc v power-down mode; v cc = 0 v 0 2.75 v t amb ambient temperature ? 40 +85 ?c ? t/ ? v input transition rise and fall rate v cc = 0.7 v to 2.75 v 0 200 ns/v
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 5 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 10. static characteristics [1] all typical values are measured at v cc = 1.2 v. table 7. static characteristics at recommended operating conditions, unless otherwise sp ecified; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions t amb = ? 40 ? c to +85 ?c unit min typ 25 ?c max 25 ?c max 85 ?c v ih high-level input voltage v cc = 0.75 v to 0.85 v 0.75v cc ---v v cc = 1.1 v to 1.95 v 0.65v cc ---v v cc = 2.3 v to 2.7 v 1.6 - - - v v il low-level input voltage v cc = 0.75 v to 0.85 v - - 0.25v cc 0.25v cc v v cc = 1.1 v to 1.95 v - - 0.35v cc 0.35v cc v v cc = 2.3 v to 2.7 v - - 0.7 0.7 v v oh high-level output voltage i o = ? 20 ? a; v cc = 0.7 v - 0.69 - - v i o = ? 100 ? a; v cc = 0.75 v 0.65 - - - v i o = ? 2 ma; v cc = 1.1 v 0.825 - - - v i o = ? 3 ma; v cc = 1.4 v 1.05 - - - v i o = ? 4.5 ma; v cc = 1.65 v 1.2 - - - v i o = ? 8 ma; v cc = 2.3 v 1.7 - - - v v ol low-level output voltage i o = 20 ? a; v cc = 0.7 v - 0.01 - - v i o = 100 ? a; v cc = 0.75 v - - 0.1 0.1 v i o = 2 ma; v cc = 1.1 v - - 0.275 0.275 v i o = 3 ma; v cc = 1.4 v - - 0.35 0.35 v i o = 4.5 ma; v cc = 1.65 v - - 0.45 0.45 v i o = 8 ma; v cc = 2.3 v - - 0.7 0.7 v i i input leakage current v i = 0 v to 2.75 v; v cc =0vto2.75v [1] -0.001 ? 0.1 ? 0.5 ? a i oz off-state output current v i = v ih or v il ; v o = 0 v to 2.75 v [1] -0.02 ? 0.1 ? 0.5 ? a i off power-off leakage current v i or v o = 0 v to 2.75 v; v cc =0v [1] -0.01 ? 0.1 ? 0.5 ? a ? i off additional power-off leakage current v i or v o = 0 v or 2.75 v; v cc =0vto0.1v [1] -0.02 ? 0.1 ? 0.5 ? a i cc supply current v i = 0 v or v cc ; i o = 0 a [1] -0.010.3 0.6 ? a ? i cc additional supply current v i = v cc ? 0.5 v; i o = 0 a; v cc =2.5v - 2 100 150 ? a
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 6 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 11. dynamic characteristics table 8. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit, see figure 13 . symbol parameter conditions t amb = 25 ?c t amb = ? 40 ? c to +85 ?c unit min typ [1] max min max t pd propagation delay a to y; see figure 6 [2] [5] v cc = 0.75 v to 0.85 v 3 11 38 2 132 ns v cc = 1.1 v to 1.3 v 2.0 4.3 7.0 1.8 7.3 ns v cc = 1.4 v to 1.6 v 1.6 3.2 4.7 1.5 5.0 ns v cc = 1.65 v to 1.95 v 1.4 2.7 3.8 1.2 4.1 ns v cc = 2.3 v to 2.7 v 1.1 2.1 2.8 1.0 3.1 ns t en enable time oe to y; see figure 7 [3] [5] v cc = 0.75 v to 0.85 v 5 15 45 4 160 ns v cc = 1.1 v to 1.3 v 2.7 5.6 8.7 2.5 9.1 ns v cc = 1.4 v to 1.6 v 2.1 4.1 5.8 1.9 6.2 ns v cc = 1.65 v to 1.95 v 1.7 3.4 4.8 1.5 5.2 ns v cc = 2.3 v to 2.7 v 1.4 2.6 3.6 1.2 3.9 ns t dis disable time oe to y; see figure 7 [4] v cc = 0.75 v to 0.85 v 4 14 42 1 152 ns v cc = 1.1 v to 1.3 v 2.9 5.9 9.5 2.7 9.9 ns v cc = 1.4 v to 1.6 v 2.3 4.4 6.6 2.0 7.1 ns v cc = 1.65 v to 1.95 v 2.4 4.5 6.6 2.1 7.1 ns v cc = 2.3 v to 2.7 v 1.7 3.3 4.7 1.5 5.1 ns t t transition time v cc = 2.7 v; see figure 6 [6] --- 1.0 - ns c i input capacitance v i = 0 v or v cc ; v cc =0vto2.75v -0.5- - - pf c o output capacitance v o = 0 v; v cc =0v - 1 - - - pf
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 7 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state [1] all typical values are measured at nominal v cc . [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzh and t pzl . [4] t dis is the same as t phz and t plz . [5] for additional propagation delays and enable times values at different load capacitances see figure 8 to figure 12 . [6] t t is the same as t thl and t tlh . [7] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+c l ? v cc 2 ? f o where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching. 12. waveforms c pd power dissipation capacitance f i = 1 mhz; v i =0 vtov cc [7] v cc = 0.75 v to 0.85 v - 2.4 - - - pf v cc = 1.1 v to 1.3 v - 2.5 - - - pf v cc = 1.4 v to 1.6 v - 2.6 - - - pf v cc = 1.65 v to 1.95 v - 2.6 - - - pf v cc = 2.3 v to 2.7 v - 3.0 - - - pf table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit, see figure 13 . symbol parameter conditions t amb = 25 ?c t amb = ? 40 ? c to +85 ?c unit min typ [1] max min max measurement points are given in table 9 . v ol and v oh are typical output voltage levels that occur with the output load. fig 6. the data input (a) to output (y) propagation delays ddd 9 2+ 9 , 9 2/ $ lqsxw <r xwsxw 9 0 9 0 *1' w 3+/ w 3/+ w 7+/ w 7/+ 9 0 9 0
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 8 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state measurement points are given in table 9 . logic levels: v ol and v oh are typical output voltage drops that occur with the output load. fig 7. enable and disable times mna644 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high oe input v i v ol v oh v cc v m gnd gnd t pzl t pzh v m v m table 9. measurement points supply voltage input output v cc v m v i t r = t f v m v x v y 0.75 v to 1.6 v 0.5v cc v cc ? 3.0 ns 0.5v cc v ol ? 0.1 v v oh ? 0.1 v 1.65 v to 2.7 v 0.5v cc v cc ? 3.0 ns 0.5v cc v ol ? 0.15 v v oh ? 0.15 v t amb = ?40 ? c to +85 ? c unless otherwise specified. (1) minimum: v cc = 2.7 v (2) typical: t amb = 25 ? c; v cc = 2.5 v (3) maximum: v cc = 2.3 v t amb = ?40 ? c to +85 ? c unless otherwise specified. (1) minimum: v cc = 1.95 v (2) typical: t amb = 25 ? c; v cc = 1.8 v (3) maximum: v cc = 1.65 v fig 8. additional t pd and t en versus load capacitance fig 9. additional t pd and t en versus load capacitance ddd & / s) ?w qv ddd & / s) ?w qv
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 9 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state t amb = ?40 ? c to +85 ? c unless otherwise specified. (1) minimum: v cc = 1.6 v (2) typical: t amb = 25 ? c; v cc = 1.5 v (3) maximum: v cc = 1.4 v t amb = ?40 ? c to +85 ? c unless otherwise specified. (1) minimum: v cc = 1.3 v (2) typical: t amb = 25 ? c; v cc = 1.2 v (3) maximum: v cc = 1.1 v fig 10. additional t pd and t en versus load capacitance fig 11. additional t pd and t en versus load capacitance ddd & / s) ?w w qv ddd & / s) ?w qv t amb = ?40 ? c to +85 ? c unless otherwise specified. (1) minimum: v cc = 0.85 v (2) typical: t amb = 25 ? c; v cc = 0.8 v (3) maximum: v cc = 0.75 v fig 12. additional t pd and t en versus load capacitance ddd & / s) ?w qv
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 10 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state test data is given in table 10 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 13. test circuit for measuring switching times 9 (;7 9 && 9 , 9 2 pqd '87 & / 5 7 5 / 5 / * table 10. test data supply voltage load v ext v cc c l r l t plh , t phl t pzh , t phz t pzl , t plz 0.75 v to 2.7 v 5 pf 10 k ? 0 v0 v2 ? v cc
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 11 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 13. package outline fig 14. package outline sot886 (xson6) 5hihuhqfhv 2xwolqh yhuvlrq (xurshdq surmhfwlrq ,vvxhgdwh ,(& -('(& -(,7$ 627 02 vrwbsr 8qlw pp pd[ qrp plq $ 'lphqvlrqvppduhwkhruljlqdoglphqvlrqv 1rwhv ,qfoxglqjsodwlqjwklfnqhvv &dqehylvleohlqvrphpdqxidfwxulqjsurfhvvhv ;621sodvwlfh[wuhpho\wklqvpdoorxwolqhsdfndjhqrohdgvwhuplqdoverg\[[pp 627 $ e '(hh // whuplqdo lqgh[duhd ' ( h h $ e / / h pp vfdoh [ [ $
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 12 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state fig 15. package outline sot1115 (xson6) 5hihuhqfhv 2xwolqh yhuvlrq (xurshdq surmhfwlrq ,vvxhgdwh ,(& -('(& -(,7$ 627 vrwbsr 8qlw pp pd[ qrp plq $ 'lphqvlrqv 1rwh ,qfoxglqjsodwlqjwklfnqhvv 9lvleohghshqglqjxsrqxvhgpdqxidfwxulqjwhfkqrorj\ ;621h[wuhpho\wklqvpdoorxwolqhsdfndjhqrohdgv whuplqdoverg\[[pp 627 $ e '( hh / / p p vfdoh whuplqdo lqgh[duhd ' ( ? h h h / / e ? $ $
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 13 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state fig 16. package outline sot1202 (xson6) 5hihuhqfhv 2xwolqh yhuvlrq (xurshdq surmhfwlrq ,vvxhgdwh ,(& -('(& -(,7$ 627 vrwbsr 8qlw pp pd[ qrp plq $ 'lphqvlrqv 1rwh ,qfoxglqjsodwlqjwklfnqhvv 9lvleohghshqglqjxsrqxvhgpdqxidfwxulqjwhfkqrorj\ ;621h[wuhpho\wklqvpdoorxwolqhsdfndjhqrohdgv whuplqdoverg\[[pp 627 $ e '( hh / / p p vfdoh whuplqdo lqgh[duhd ' ( ? h h h / e / ? $ $
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 14 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state fig 17. package outline sot1226 (x2son5) 5hihuhqfhv 2xwolqh yhuvlrq (xurshdq surmhfwlrq ,vvxhgdwh ,(& -('(& (,$- 627 vrwbsr 8qlw pp pd[ qrp plq $ 'lphqvlrqv 1rwh 'lphqvlrq$lvlqfoxglqjsodwlqjwklfnqhvv 3odvwlfruphwdosurwuxvlrqvripppd[lpxpshuvlghduhqrwlqfoxghg 627 $ $ '' k (eh n/y z\ vfdoh p p ; whuplqdo lqgh[duhd ' ( $ % ghwdlo; $ $ $ & \ & \ whuplqdo lqgh[duhd ' k / e n h $& % y & z \ ;621sodvwlfwkhupdohqkdqfhgh[wuhpho\wklqvpdoorxwolqhsdfndjhqrohdgv whuplqdoverg\[[pp
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 15 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 14. abbreviations 15. revision history table 11. abbreviations acronym description cdm charged device model dut device under test esd electrostatic discharge hbm human body model table 12. revision history document id release date data sheet status change notice supersedes 74axp1g125 v.1 20140116 product data sheet - -
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 16 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? 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stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74axp1g125 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2014. all rights reserved. product data sheet rev. 1 ? 16 january 2014 17 of 18 nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74axp1g125 low-power buffer/line driver; 3-state ? nxp b.v. 2014. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 16 january 2014 document identifier: 74axp1g125 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 contact information. . . . . . . . . . . . . . . . . . . . . 17 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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